Integrity of packaging, consistency of internal and external packaging and correctness of packaging contents such as moisture-proof bags, desiccants, moisture-sensitive cards, etc.
Check the brand, model, quantity, batch, date of manufacture, lace of origin, moisture sensitivity level and environmental label, and compare the specifications with company's internal database.
Check whether the three packaging methods of tape, tray and tube are in compliance with specifications and industry regulations.
Measure whether the main external dimensions of the device are within the tolerances of the specification.
Observe the pin terminals and BGA balls under a magnifying glass to confirm that their packaging are consistent with the specifications and to observe whether there are any scratches, deformations, missing, oxidation and other abnormalities.
Use a specific solvent to wipe the marking and other areas of the device, and observe the changes in the wiped area and the residue on the cotton swab to rule out the possibility of Remarking/Resurfacing.
Use a blade or sharp tool to scratch the surface of the device to see if there is any lump coating off, to confirm whether there is a secondary coating on the surface of the device.
The insulation resistance test is an electrical test which uses a certain type and level of voltage to measure insulation resistance in Ohm`s. Typically, it is used to measure the insulation resistance and withstanding voltage of MLCC.
Discrete test mainly measures electrical parameters of IGBT, MOSFET and Diodes. It is also used for Open/Short Test and I/V curve analysis.
LCR meter is used to measure the resistance, capacitance and inductance of a conductor. Meanwhile, it also measures parameters of |Z|/|Y|/D/Q/X/B/∅ etc.
JESD22-B102E standard and dip-and-look method are applied to test lead/leadless component solderability .lt can eliminate poor welding resulted from oxidization or contamination.
X-Ray fluorescence is used for conducting material analysis to determine the elemental composition of a material sample. It is most commonly applied to determine the amounts of controlled elements specified within the Restriction of Hazardous Substances (RoHS) Directive.Meanwhile, it can also identity the elements composition in specific location when comparing to golden sample or trelated datasheet.
X-Ray test is a non-destructive radiological inspection for internal construction verification. It’s a screening method used to verify die presence, bond wires, leadframe and the consistency from one component to the next or known good sample.
Chemical decapsulation is the removal of the molding material of package to expose internal structure while confined in a protected chamber. It involves the dispensing of controlled amounts of acids on the package. Exposing the die makes the die available for verification of die presence and connectivity, manufacturer markings and topography, and die measurements.
As an ERAI member, our testing standards adhere to global distributor electronic component testing standards, such as IDEA-STD-1010-B and SAE AS6171, industry-common standards, and our own experience accumulated over several years. We continuously pursue high-precision and high-standard product quality levels.
To prevent losses caused by counterfeit and inferior products in the semiconductor market, Depend cooperates with third-party authorized testing organizations and other test labs to provide professional testing services.
