01. SIA: Q3 global chip sales up 15.8 % sequentially, Asia-Pacific and Americas lead
On Nov 11, the Semiconductor Industry Association (SIA) said worldwide semiconductor revenue reached US$208.4 bn in 2025 Q3, up 15.8% vs Q2 and 25.1% YoY. September alone hit US$6.95 bn, up 7 % MoM. Asia-Pacific (excluding China and Japan) and the Americas were the strongest drivers, lifted by data centre and HPC demand; Japan was the only region to decline YoY.
02. NAND flash vendors raise quotes 50–100 %
On Nov 12, NAND flash makers have lifted contract prices 50–100 % in two weeks, according to media reports. 512 GB TLC wafer prices have nearly doubled; 1 Tb QLC/TLC tags are at all-time highs. Supply-chain panic buying has pushed eMMC/UFS up >50 %. Spot-market low-cost inventory is “nowhere to be found”, keeping SSD and DDR4/DDR5 prices elevated. AI-server demand is exploding—Q4 server DDR5 RDIMM 96 GB is already quoted at US $740.
03. ST sees Q1-26 revenue stabilising, customer inventories digested
12 Nov – CEO Jean-Marc Chery said STMicro expects Q1-26 revenue of ~US $3.28 bn, down 10-11 % QoQ but up ~20 % YoY, signalling a return to normal seasonal patterns. Customer inventory overhang is “largely cleared”; the company will enter the AI-server chip market in 2026, targeting US$300 m revenue within three years and at least US$500 m before 2030.
04. Memory giants to cut NAND output in concert; Samsung, SK hynix first to move
13 Nov – Samsung, SK hynix, Kioxia and Micron plan simultaneous NAND flash production cuts in 2H-25 to prop up prices, reports Chosun Ilbo. Samsung has trimmed its 2025 NAND wafer-start target to 4.72 m sheets, –7 % YoY, and is readying 20–30 % price hikes; SK hynix shipments are set to fall ~10 %. Spot 512 GB TLC has already jumped 14.2 % in two weeks to US $5.51 and may rise another 40–50 % next quarter. Makers are also shifting capacity to high-margin QLC to serve AI high-capacity SSD demand. Although 2026 capex will still grow, most funds go to HBM4 and 1γ nodes, so bit-supply growth stays tight. With the top four vendors controlling >90 % of output, their aligned cuts have drawn potential “collusive behaviour” scrutiny.
05. AI boom lifts data-centre TAM to US$1 trn by 2030
13 Nov – At AMD’s Financial Analyst Day CEO Lisa Su forecast the AI data-centre market will reach US$1 trn in 2030, spanning CPUs, networking and AI accelerators. AMD targets 35 % CAGR revenue growth over the next 3-5 years, 60 % for data-centre, and EPS of US $20. MI400-series AI GPUs launch next year; rack-scale systems to compete with Nvidia GB200 are in the pipeline, accelerated by the ZT Systems acquisition and a new four-year, US$100 bn revenue-sharing agreement with OpenAI.
06. TSMC to raise sub-5-nm wafer prices 8–10 % starting 2026
13 Nov – TSMC has informed customers that 3 nm and 5 nm wafer prices will increase 8–10 % from 2026 to offset record-high utilisation and protect margins. Apple, Nvidia and Qualcomm have maxed out capacity; 2 nm is in risk production with a projected US$30k cost per wafer, ~50 % above 3 nm. Advanced nodes already account for 74 % of TSMC revenue, a share set to climb as 2 nm ramps.