01. SIA: Global Semiconductor Sales Surge 18.7% Year-on-Year in July

The Semiconductor Industry Association (SIA) revealed today that worldwide semiconductor sales reached $51.3 billion in July 2024. This marks an impressive 18.7% uptick from $43.2 billion in July 2023. Additionally, this figure shows a 2.7% increase from June 2024's $50.0 billion, maintaining a positive growth streak for the fourth straight month.

“The global semiconductor market experienced strong year-on-year growth in July, with consecutive monthly gains enhancing the industry's momentum,” stated John Neuffer, SIA President and CEO. “The Americas market excelled, posting a remarkable 40.1% year-on-year sales increase, leading regional growth.”

Regionally, year-on-year sales surged significantly in the Americas (40.1%), China (19.5%), and Asia Pacific/All Other (16.7%). Conversely, sales slid in Japan (-0.8%) and Europe (-12.0%). Month-to-month, July's sales rose in the Americas (4.3%), Asia Pacific/All Other (3.9%), Japan (3.3%), and China (0.9%), but experienced a slight decline in Europe (-0.5%).

02. Advanced Packaging Equipment Market Expected to Grow Over 10% In 2024

TrendForce data reveals that the advanced packaging equipment market is set to grow by over 10% in 2024 and exceed 20% in 2025. Major semiconductor firms are expanding capacities due to the booming global AI server market, driving demand for technologies like InFO, CoWoS, and SoIC. TSMC and Intel are notably expanding in Taiwan and New Mexico, while Samsung, SK Hynix, and Micron build new HBM facilities across the globe. This growth fuels demand for equipment like electroplating and dicing machines. With low entry barriers, firms like TSMC support local suppliers to cut costs. TrendForce highlights that Taiwanese manufacturers must align capacity expansion with market trends for success, presenting collaboration opportunities with foundries and OSAT providers as they eye international growth.

03.  NXP and VIS Launch VSMC Joint Venture, Announce 300mm Fab In Singapore

NXP and Vanguard International Semiconductor Corporation(VIS) have successfully launched their joint venture, VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), following the receipt of all necessary regulatory approvals and the completion of capital injection. This milestone paves the way for the development of VSMC's first 300mm wafer manufacturing facility in Singapore.

VSMC will begin construction on its first phase later this year, with initial production targeted for 2027. A second phase will be considered upon successful ramp-up, subject to commitments from both NXP and VIS. The 300mm fab will specialize in manufacturing 130nm to 40nm mixed-signal, power management, and analog products, catering to automotive, industrial, consumer, and mobile markets. A Technology License Agreement with TSMC has been signed, facilitating the transfer of necessary technologies.

The facility is expected to achieve a monthly production capacity of 55,000 300mm wafers by 2029, creating around 1,500 jobs and bolstering Singapore’s role in the global semiconductor ecosystem. The joint venture is set to contribute significantly to the development of the upstream and downstream supply chains, enhancing NXP's manufacturing capabilities and positioning it to better serve its customers worldwide.

04. SK Hynix Unveils Breakthrough 10nm DDR5 DRAM, Leading Global Market

SK Hynix has unveiled the successful creation of the first sixth-generation 10nm-class (1c) 16Gb DDR5 DRAM, showcasing its forefront capabilities in advanced microfabrication. The firm emphasized that this new process enhances the high-performance fifth-generation (1b) DRAM framework by refining specific EUV techniques and incorporating new materials, thereby significantly improving cost efficiency and production yield.

The new 1c DDR5 DRAM targets high-performance data centers, achieving an operating speed of 8Gbps. This marks an 11% performance increase over its predecessor, along with a more than 9% enhancement in energy efficiency. SK Hynix anticipates that cloud service providers' uptake of 1c DRAM could dramatically lower electricity expenses.

Additionally, SK Hynix mentioned that the 1c process's development utilized the 1b platform to reduce trial and error, resulting in a production efficiency spike of over 30% compared to earlier generations. The company aims to finalize mass production preparations within the year, launching products in 2025.

This technological advancement will apply to upcoming high-performance DRAM offerings, including HBM, LPDDR6, and GDDR7, providing unique value to clients. SK Hynix is dedicated to preserving its leadership in the DRAM sector and solidifying its role as a reliable provider of AI-enhanced memory solutions.

05. Qualcomm Collaborates with Samsung and Google to Create Mixed Reality Smart Glasses

Qualcomm CEO Cristiano Amon recently announced that the company collaborates with Samsung and Google to develop a new kind of mixed reality glasses designed to connect seamlessly with smartphones. Reports suggest that these glasses will be lighter and prioritize smartphone compatibility, moving away from a standalone, bulkier head-mounted device similar to Apple's Vision Pro.

Notably, in February of the previous year, these three tech leaders established a partnership to create a mixed reality platform, although specific products and timelines remain undisclosed. Mixed reality encompasses technologies that merge elements of augmented reality (AR) and virtual reality (VR), enabling a blend of virtual images and real-world contexts for a more immersive experience. Last year, smart glasses branded as "Ray-Ban Meta" debuted, powered by Qualcomm's Snapdragon AR1 Gen 1 chip. Meanwhile, generative artificial intelligence remains an unexplored frontier in mixed reality, and the broad implementation of AI technology promises to deliver an entirely new user experience.

06. TSMC Develops Next-Generation Silicon Photonics Technology with a Goal to Start Production

Nikkei News reports that TSMC is ramping up the development of next-generation silicon photonics solutions. The company collaborates with leading global chip designers and suppliers, aiming to begin production within three to five years. K.C. Hsu, TSMC's Vice President of Integrated Interconnect and Packaging, noted that while the silicon photonics market is in its infancy, it is projected to expand at a compound annual growth rate of 40% from 2023, potentially reaching $500 million by 2028. Hsu acknowledged the challenges in specifying the mass production timeline. The industry views silicon photonics as vital for various applications, including artificial intelligence, data communication, 6G, and quantum computing. Optical transmission outperforms traditional data methods by being more energy-efficient and reducing latency, thereby addressing the increasing heat and energy challenges faced by artificial intelligence data centers.